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Fracture and adhesion behaviors of epoxy resins modified with poly(amine‐quinone)
Author(s) -
Jin FanLong,
Han Mijeong,
Park SooJin
Publication year - 2006
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.2075
Subject(s) - epoxy , diglycidyl ether , materials science , fracture toughness , dynamic mechanical analysis , composite material , glass transition , monomer , toughness , bisphenol a , adhesion , modulus , hydroquinone , adhesive , polymer chemistry , polymer , chemistry , organic chemistry , layer (electronics)
Abstract An amine‐quinone monomer, i.e. 2,5‐bis(4,4′‐methylenedianiline)‐1,4‐benzoquinone (BB), was synthesized by the Michael addition of 4,4′‐diaminodiphenyl methane with 1,4‐benzoquinone. To evaluate the effect of BB content on the glass transition temperature ( T g ) and crosslinking density (ρ) of cured diglycidyl ether of bisphenol A (DGEBA)/BB systems, storage modulus and loss factor measurements were obtained using dynamic mechanical analysis. The mechanical properties of the systems were determined in terms of the fracture toughness, impact strength, and adhesion strength. As a result, the ρ values of the systems were found to decrease systematically as the BB content increased. The fracture toughness and adhesion strength of the systems increased with increasing BB content. These results indicate that the addition of BB into epoxy resins increases the free volume of the epoxy network and absorbs the deformation energy, resulting in an improvement of the mechanical properties of the DGEBA/BB systems. Copyright © 2006 Society of Chemical Industry