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Preparation and thermal properties of bismaleimide blends based on hydroxyphenyl maleimide
Author(s) -
Rao BS,
Sireesha R,
Pasala AR
Publication year - 2005
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.1808
Subject(s) - maleimide , glass transition , differential scanning calorimetry , dynamic mechanical analysis , materials science , exothermic reaction , bisphenol a , composite material , polymer chemistry , thermal analysis , epoxy , polymer , thermal , organic chemistry , chemistry , thermodynamics , physics
N ‐(4‐hydroxyphenyl)maleimide was melt‐blended with the glycidyl ether of bisphenol‐A and various mole percentages of 4, 4′‐(diaminodiphenylsulfone) bismaleimide. The cure behaviour of the resins was evaluated by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The blends showed distinct reductions in the onset of cure ( T o ) and peak exothermic ( T exo ) temperatures. The blends cured at low temperatures exhibited glass transition temperatures ( T g s) higher than the cure temperatures. The cured blends showed high moduli, glass transition temperatures in excess of 250 °C and good thermal stabilities up to 400 °C. Copyright © 2005 Society of Chemical Industry