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Cationic electron‐beam curing of a high‐functionality epoxy: effect of post‐curing on glass transition and conversion
Author(s) -
Rath SK,
Boey FYC,
Abadie MJM
Publication year - 2004
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.1383
Subject(s) - curing (chemistry) , epoxy , glass transition , materials science , differential scanning calorimetry , cationic polymerization , fourier transform infrared spectroscopy , composite material , photoresist , cathode ray , polymer , polymer chemistry , chemical engineering , electron , thermodynamics , physics , layer (electronics) , engineering , quantum mechanics
This paper reports on the cationic electron‐beam curing of a high‐functionality SU8 epoxy resin, which is extensively used as a UV‐curing negative photoresist for micro‐electronics machine systems (MEMS) applications. Results show that elevated post‐curing treatment significantly increased both the conversion and the glass transition. The degree of conversion and the glass transition temperature were measured by using Fourier‐transform infrared (FTIR) spectroscopy and modulated differential scanning calorimetry (MDSC ® ), respectively. The glass transition temperature ( T g ), which has been observed to be dependent on the degree of conversion, reaches a maximum of 162 °C at 50 Mrad and post‐curing at 90 °C. The degradation pattern of the cured resin does not show much variation for exposure at 5 Mrad, but does show significant variation for 50 Mrad exposure at various post‐curing temperatures. A degree of conversion of more than 0.8 was achieved at a dosage of 30 Mrad with post curing at 80 °C, for the epoxy resin with an average functionality of 8 a feature simply not achievable when using UV‐curing. Copyright © 2004 Society of Chemical Industry