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Curing kinetics and thermal property characterization of the bisphenol‐F epoxy resin and phthalic anhydride system
Author(s) -
Gao Jungang,
Zhao Hongchi,
Li Yanfang
Publication year - 2002
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.1078
Subject(s) - phthalic anhydride , thermogravimetric analysis , differential scanning calorimetry , curing (chemistry) , bisphenol a , autocatalysis , epoxy , materials science , polymer chemistry , kinetics , glass transition , bisphenol , chemical engineering , composite material , chemistry , organic chemistry , thermodynamics , polymer , catalysis , physics , quantum mechanics , engineering
The curing kinetics of bisphenol‐F epoxy resin (BPFER) and curing agent phthalic anhydride, with N,N ‐dimethylbenzylamine as an accelerator, were studied by differential scanning calorimetry (DSC). Analysis of DSC data indicated autocatalytic behaviour in the first stages of the cure for the system, and that this, could be well described by the model proposed by Kamal, which includes two rate constants, k 1 and k 2 , and two reaction orders, m and n . The curing reaction in the later stages was practically diffusion‐controlled. To consider the diffusion effect more precisely, a diffusion factor, (α), was introduced into Kamal's equation. The glass transition temperatures ( T g s) of the BPFER/phthalic anhydride samples were determined by means of torsional braid analysis. The thermal degradation kinetics of cured BPFER were investigated by thermogravimetric analysis. © 2002 Society of Chemical Industry