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Characterization of cure reactions of anhydride/epoxy/polyetherimide blends
Author(s) -
Kim Minyoung,
Kim Wonho,
Choe Youngson,
Park JoungMan,
Park InSeo
Publication year - 2002
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/pi.1032
Subject(s) - polyetherimide , epoxy , diglycidyl ether , materials science , curing (chemistry) , miscibility , autocatalysis , bisphenol a , composite material , differential scanning calorimetry , polymer chemistry , polymer blend , reaction rate , order of reaction , kinetics , reaction rate constant , organic chemistry , copolymer , polymer , chemistry , catalysis , physics , quantum mechanics , thermodynamics
The cure kinetics of blends of epoxy (diglycidyl ether of bisphenol A)/anhydride (nadic methyl anhydride) resin with polyetherimide (PEI) were studied using differential scanning calorimetry under isothermal conditions to determine the reaction parameters such as activation energy and reaction constants. By increasing the amount of PEI in the blends, the final cure conversion was decreased. Lower values of final cure conversions in the epoxy/PEI blends indicate that PEI hinders the cure reaction between the epoxy and the curing agent. The value of the reaction order, m , for the initial autocatalytic reaction was not affected by blending PEI with epoxy resin, and the value was approximately 1.0. The value of n for the n th order component in the autocatalytic analysis was increased by increasing the amount of PEI in the blends, and the value increased from 1.6 to 4.0. A diffusion‐controlled reaction was observed as the cure conversion increased and the rate equation was successfully analyzed by incorporating the diffusion control term for the epoxy/anhydride/PEI blends. Complete miscibility was observed in the uncured blends of epoxy/PEI at elevated temperatures up to 120 °C, but phase separations occurred in the early stages of the curing process. © 2002 Society of Chemical Industry