Open AccessA photonic MEMS interposer to solve electronic and optical assembly challenges
Author(s) -
Li Jian,
Sielecki Andrzej,
Beletkaia Elena
Publication year - 2022
Publication title -
photonicsviews
Language(s) - English
Resource type - Journals
eISSN - 2626-1308
pISSN - 2626-1294
DOI - 10.1002/phvs.202200027
Subject(s) - interposer , microelectronics , miniaturization , photonics , microelectromechanical systems , computer science , nanotechnology , face (sociological concept) , systems engineering , engineering , materials science , optoelectronics , etching (microfabrication) , layer (electronics) , social science , sociology
Photonic applications often face industry‐specific assembly requirements that can be challenging to overcome. There is a need for micron‐accurate alignment, device miniaturization and integration in challenging form factors. Special materials and packaging must be developed for the best performance of the devices in exacting environmental conditions. In the medical field, these requirements are additionally complicated by the demanding ISO 13485 regulations. The article demonstrates how solutions are found in a combination of new and existing technology in microelectronics packaging and now made suitable for photonics.