Open AccessCombining High‐Tech Glass Innovations with Advanced Laser Technologies
Author(s) -
Brueckner Julia,
Gaab Andreas,
Gajendran Prakash
Publication year - 2020
Publication title -
photonicsviews
Language(s) - English
Resource type - Journals
eISSN - 2626-1308
pISSN - 2626-1294
DOI - 10.1002/phvs.202000037
Subject(s) - wafer dicing , wafer , laser , materials science , toughened glass , optoelectronics , engineering physics , optics , engineering , composite material , physics
Abstract As glass wafer products become more specialized and die sizes get smaller, the demand for high‐speed singulation of glass wafers is increasing. Corning Laser Technologies utilizes the advantages of precise laser dicing to process optimized glass types with adapted CTE values, high transmission, and specific refractive indices to enable existing and emerging applications.