Open AccessThe Antennae Challenge
Author(s) -
Haloui Hatim,
Müller Dirk
Publication year - 2020
Publication title -
photonicsviews
Language(s) - English
Resource type - Journals
eISSN - 2626-1308
pISSN - 2626-1294
DOI - 10.1002/phvs.202000004
Subject(s) - electronic circuit , laser , optoelectronics , thermal , adhesive , process (computing) , computer science , materials science , insulator (electricity) , integrated circuit , electronic engineering , optics , nanotechnology , electrical engineering , engineering , physics , meteorology , layer (electronics) , operating system
The high frequency antennae and circuits that enable 5G connectivity require more complex shapes and finer details than earlier devices but USP lasers enable these patterns to be created in a single dry process that can cut copper, insulator and adhesive layers without any thermal damage.