Open AccessAutomation Tools for Packaging and Testing
Author(s) -
González Ana Belén
Publication year - 2019
Publication title -
photonicsviews
Language(s) - English
Resource type - Journals
eISSN - 2626-1308
pISSN - 2626-1294
DOI - 10.1002/phvs.201970510
Subject(s) - automation , manufacturing engineering , epic , computer science , systems engineering , emerging technologies , packaging engineering , engineering , risk analysis (engineering) , engineering management , business , mechanical engineering , artificial intelligence , art , literature
Abstract Photonic technologies have an impressive potential to introduce new and amazing functionality in different devices. However, there are still bottlenecks that hinder the introduction of these highly mature technologies into innovative products mainly related to packaging and testing of these devices, together with the lack of automatized tools and standards that would allow a cost‐effective ramping up in the production. To face these challenges, 74 top experts in packaging and automated processes met at the EPIC meeting on automation tools for packaging and testing at Amicra technologies (Regensburg, Germany, on 23 – 24 May) to decide the guidelines for the manufacturing of the next generation of photonic‐based products. This article gives an overview of the learnings from this meeting as well as the main discussions and technologies presented there.