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Assessment of residual stresses during cure and cooling of epoxy resins
Author(s) -
Wang HongBing,
Yang YuGeng,
Yu HuiHong,
Sun WeiMing,
Zhang YingHua,
Zhou HongWei
Publication year - 1995
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760352309
Subject(s) - materials science , epoxy , shrinkage , residual stress , curing (chemistry) , composite material , stress (linguistics) , glass transition , residual , polymer , philosophy , linguistics , algorithm , computer science
A new stress monitoring technique, a stress‐tracking device, is described here. It has been used to study some important properties of epoxy resin. Residual stresses, including a curing shrinkage stress and a cooling shrinkage stress, were measured automatically and continuously during curing and cooling. Simultaneously, information such as an apparent gelation time and glass transition temperature were obtained directly during the experiment. These epoxy resin properties were related to the extent of cure. Varying cure temperature produced changes of cure behavior, which resulted in different residual stresses.