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A study on interfacial adhesion of poly(vinylidene fluoride) with substrates in a multilayer structure
Author(s) -
Whang WhaTzong,
Cheng WenHua
Publication year - 1995
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760350806
Subject(s) - materials science , composite material , substrate (aquarium) , adhesion , fluoride , joint (building) , coupling (piping) , deformation (meteorology) , scanning electron microscope , structural engineering , chemistry , inorganic chemistry , oceanography , engineering , geology
The peel force of a PVDF/3‐APS/Si joint and a PVDF/3‐APS/Al joint can reach the same level by treating the Si substrate with ⩾ 0.3% 3‐aminopropyltriethoxy silane (3‐APS) solution and treating the aluminum substrate with NH 3 solution (pH 10.5) first and then with ⩾ 3% 3‐APS solution. Scanning electron micrographs show that the interfacial adhesion mechanisms of PVDF/3‐APS/Si joints and PVDF/3‐APS/Al joints are different. In the peel test, the PVDF [poly(vinylidene fluoride)] break surfaces from PVDF/3‐APS/Si joints reveal striations on the surface and less plastic deformation. The significant plastic deformation of the PVDF at the break surface may result from the deeper interpenetration of 3‐APS with PVDF in the PVDF/3‐APS/Al joint than in the PVDF/3‐APS/Si joint. The peel force of PVDF film/substrate joint depends on many factors: film thickness, peel rate, concentration of coupling agent, the treatment time of the coupling agent on the substrate, and the substrate pretreatment.