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Plasma polymerized tetramethyl germanium films deposited at elevated substrate temperatures
Author(s) -
Sadhir R. K.,
Saunders H. E.,
Byers W. A.
Publication year - 1993
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760331010
Subject(s) - germanium , materials science , substrate (aquarium) , conductivity , deposition (geology) , analytical chemistry (journal) , electrical resistivity and conductivity , carbon fibers , thin film , polymerization , carbon film , plasma , chemical engineering , composite material , silicon , nanotechnology , metallurgy , chemistry , chromatography , polymer , oceanography , composite number , engineering , biology , paleontology , quantum mechanics , physics , sediment , geology , electrical engineering
Thin plasma polymerized films of tetramethyl germanium are deposited at various substrate temperatures. The influence of substrate temperature on the deposition rate, composition, structure, and electrical properties of the films is discussed. With an increase in the substrate temperature from 25°C to 150°C under similar plasma deposition conditions, the conductivity of the film increased by four orders of magnitude. Films of plasma polymerized tetramethyl germanium deposited at 150°C show typical semiconducting behavior (increasing conductivity with increasing temperature) and have a sheet conductivity of 1.0 × 10 −6 S cm −1 at 25°C. There is a direct correlation between the conductivity and the composition of the films, i.e., the higher the conductivity the higher the ratio of germanium to carbon at the surface. At deposition temperatures of 25 and 75°C the germanium to carbon ratio was essentially the same, but at a deposition temperature of 150°C, this ratio was considerably higher.