Premium
On the thermal behavior and mechanism of residual microstress buildup at the matrix interface in filled epoxy resins
Author(s) -
Wang HongBing,
Li ShanJun,
Yu TongYin
Publication year - 1993
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760330805
Subject(s) - materials science , annealing (glass) , residual stress , composite material , epoxy , residual , glass transition , polymer , algorithm , computer science
Abstract We have detailed the effects of annealing and temperature on the residual microstress at the matrix interface in rubber‐filled and glass bead‐filled epoxy resin systems. We found that annealing renders changes in residual microstress. The closer the annealing temperature to the glass transition temperature of the sample, the more pronounced the annealing effect on the stress. Also, we examined the interfacial residual microstress and found a linear relationship with annealing temperature. A description of the mechanism of the interfacial microstress buildup is proposed.