On the thermal behavior and mechanism of residual microstress buildup at the matrix interface in filled epoxy resins

We have detailed the effects of annealing and temperature on the residual microstress at the matrix interface in rubber‐filled and glass bead‐filled epoxy resin systems. We found that annealing renders changes in residual microstress. The closer the annealing temperature to the glass transition temperature of the sample, the more pronounced the annealing effect on the stress. Also, we examined the interfacial residual microstress and found a linear relationship with annealing temperature. A description of the mechanism of the interfacial microstress buildup is proposed.