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Photosensitive polyimidesiloxanes
Author(s) -
Choi J.O.,
Rosenfeld J. C.,
Tyrell J. A.,
Yang J. H.,
Rojstaczer S. R.,
Jeng S.
Publication year - 1992
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760322116
Subject(s) - siloxane , materials science , glass transition , curing (chemistry) , dielectric , fourier transform infrared spectroscopy , absorption of water , chemical engineering , modulus , polymer chemistry , composite material , polymer , optoelectronics , engineering
Photosensitive polyamic acid involving substituted 3, 5‐diaminobenzamide has been developed for photopatternable polyimidesiloxanes. This precursor, formulated with photosensitizers, was used to develop fine patterns by i‐line UV exposure. The curing of polyamic acid was investigated by using FTIR and physical property measurement. The cured film has a high glass transition temperature depending on the siloxane content. It is stable up to 400°C and loses some of the substituted groups on heating to 500°C. The modulus, dielectric constant, and water absorption decreased with higher siloxane content.