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Synthesis and characterization of a low stress photosensitive polyimide
Author(s) -
Nader Allan E.,
Imai Kazunori,
Craig John D.,
Lazaridis Christi.,
Murray Daniel O.,
Pottiger Michael T.,
Dombchik Stephen A.,
Lautenberger William J.
Publication year - 1992
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760322113
Subject(s) - polyimide , materials science , microelectronics , photosensitivity , characterization (materials science) , lithography , polymer , thermal expansion , substrate (aquarium) , molding (decorative) , glass transition , composite material , optoelectronics , nanotechnology , oceanography , layer (electronics) , geology
Use of polyimides with thermal coefficients of expansion comparable to that of the underlying substrate is critical to achieving low stress in microelectronic packaging applications. Photosensitive polyimides are finding increased use because of their significant reduction in device processing steps. A negative working photosensitive polyimide, based on the BPDA/PPD backbone, has been synthesized that incorporates these key features. The polyimide exhibits excellent photosensitivity and lithographic behavior, while retaining many thermal and physical properties of the polymer framework.