Vacuum metallization of polyetherimide: Interfacial chemistry and adhesion | Zendy

Porta Gregory M. | Zendy; Foust Donald F. | Zendy; Burrell Michael C. | Zendy; Karas Bradley R. | Zendy

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Vacuum metallization of polyetherimide: Interfacial chemistry and adhesion

Author(s) -

Porta Gregory M.,

Foust Donald F.,

Burrell Michael C.,

Karas Bradley R.

Publication year - 1992

Publication title -

polymer engineering and science

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.503

H-Index - 111

eISSN - 1548-2634

pISSN - 0032-3888

DOI - 10.1002/pen.760321507

Subject(s) - polyetherimide , materials science , adhesion , deposition (geology) , metal , copper , aluminium , electroless deposition , yield (engineering) , vacuum deposition , polymer , composite material , chemical engineering , metallurgy , layer (electronics) , paleontology , sediment , biology , engineering

Vacuum deposition of metal coatings on polyetherimide was investigated. High levels of adhesion (>170 g/mm) with evaporated copper were achieved through a primarily chemical interaction. Changes in the interfacial chemistry were correlated with metal/polymer adhesion. Vacuum deposition of aluminum onto polyetherimide was also examined and found to yield much lower adhesion.

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