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Vacuum metallization of polyetherimide: Interfacial chemistry and adhesion
Author(s) -
Porta Gregory M.,
Foust Donald F.,
Burrell Michael C.,
Karas Bradley R.
Publication year - 1992
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760321507
Subject(s) - polyetherimide , materials science , adhesion , deposition (geology) , metal , copper , aluminium , electroless deposition , yield (engineering) , vacuum deposition , polymer , composite material , chemical engineering , metallurgy , layer (electronics) , paleontology , sediment , biology , engineering
Vacuum deposition of metal coatings on polyetherimide was investigated. High levels of adhesion (>170 g/mm) with evaporated copper were achieved through a primarily chemical interaction. Changes in the interfacial chemistry were correlated with metal/polymer adhesion. Vacuum deposition of aluminum onto polyetherimide was also examined and found to yield much lower adhesion.