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Simultaneous acoustic wave propagation and dynamic mechanical analysis of curing of thermoset resins
Author(s) -
Chow Andrea W.,
Bellin Jack L.
Publication year - 1992
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760320304
Subject(s) - epoxy , thermosetting polymer , materials science , composite material , curing (chemistry) , dynamic mechanical analysis , stiffness , modulus , dynamic modulus , superposition principle , shear modulus , polymer , mathematics , mathematical analysis
A study of simultaneous acoustic and rheometric (dynamic mechanical) measurements of the epoxy curing process is undertaken to assess the validity of using acoustic cure‐monitoring sensors for process control. Our results demonstrate that the acoustic technique provides a sensitive means for monitoring the cure of neat epoxy over the entire cure cycle. The acoustic modulus calculated from the shear velocity qualitatively tracks the mechanically measured dynamic modulus and correctly ranks the stiffness of two epoxy compositions. When the frequency difference is accounted for, using time‐temperature superposition of the dynamic mechanical measurements, quantitative agreement between the acoustic and mechanical moduli for fully cured epoxy resins is also quite good.