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Application of the microbond technique: Characterization of carbon fiber‐epoxy interfaces
Author(s) -
Biro David A.,
McLean Paul,
Deslandes Yves
Publication year - 1991
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760311704
Subject(s) - epoxy , materials science , thermosetting polymer , composite material , composite number , toughening , shear (geology) , adhesion , carbon fiber composite , shear strength (soil) , carbon fibers , fiber , toughness , environmental science , soil science , soil water
Microbonding has been applied to measure the interfacial shear strength, τ, between single carbon fiber and microdroplets of epoxy resins. The effect of thermoset cure and resin modification on this initial parameter for composite performance have been studied. The interfacial shear strength for the host fiber/epoxy system (T‐300/Epos 828) increased 3 fold from a B‐stage to a fully cured material. The addition of a toughening agent called “Fortifier P” to the host resin system increased T by 40%. Residual thermal stresses were calculated and their contribution to mechanical adhesion were related to friction components.