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Dual polymer bonding of thermoplastic composite structures
Author(s) -
Smiley A. J.,
Halbritter A.,
Cogswell F. N.,
Meakin P. J.
Publication year - 1991
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760310709
Subject(s) - materials science , composite material , composite number , thermoplastic , polymer , softening point , compatibility (geochemistry) , softening , thermoplastic polymer
This paper describes a process that facilitates fusion bonding of thermoplastic composite components without the need for complex fixtures and without disrupting the fiber alignment in the component laminates. The dual polymer bonding process, Thermabond, requires that an interlayer polymer be fused to the surface of each laminate prior to bonding. The characteristics of the interlayer polymer allow for joining of the components at a temperature below the softening/melting point of the reinforced polymer in the composite laminates. This leads to significant processing advantages without significant loss in mechanical performance. Discussions of resin compatibility, the effect of process conditions on mechanical performance, and the application of the APC‐2/PEI Thermabond system to various structural components are included.

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