Premium
Electrically conductive adhesives: Effect of particle composition and size distribution
Author(s) -
Lyons Alan M.
Publication year - 1991
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760310611
Subject(s) - materials science , nickel , particle size , composite material , adhesive , particle (ecology) , percolation threshold , electrical conductor , particle size distribution , percolation (cognitive psychology) , epoxy , electrical resistivity and conductivity , metallurgy , chemical engineering , layer (electronics) , neuroscience , engineering , biology , geology , oceanography , electrical engineering
The effects of particle composition and size distribution on the electrical properties of conductive adhesives were studied. Silver‐plated glass and silver‐plated nickel particles with both narrow (37‐44 μm) and broad (< 44 μm) size distributions were dispersed in an epoxy matrix. In all cases, formulations incorporating narrow particle size distributions required greater concentrations of particles to exceed the percolation threshold for electrical conduction than when broad particle distributions were used. Differences between glass and nickel particles were observed and attributed to the higher density of nickel particles, as well as subtle variations in particle size distributions.