z-logo
Premium
Experimental modeling of solvent‐casting thin polymer films
Author(s) -
Powers G. W.,
Collier J. R.
Publication year - 1990
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760300208
Subject(s) - solvent , materials science , casting , polymer , interfacing , thermogravimetric analysis , gravimetric analysis , chemical engineering , thin film , composite material , analytical chemistry (journal) , optics , nanotechnology , chromatography , organic chemistry , chemistry , computer science , physics , computer hardware , engineering
An apparatus was designed and assembled to study the solvent removal from solution‐cast thin polymer films. The computer interfacing of a thermogravimetric analyzer, spectrophotometer, electronic flowmeters, and control valves for the apparatus enabled the preprogramming of the carrier gas velocity, carrier gas solvent content, and temperature profiles to simulate the environment experienced in large parallel flow industrial driers. The apparatus has also been designed and operated to enable the visual observation of the drying film with an optical microscope. Initial experimental studies conducted with the apparatus involved the effect of temperature on solvent removal. The results indicate that high dryer gas temperatures can apparently cause skinning of the film surface resulting in slower solvent removal rates. The skin formation can be suppressed by higher solvent concentration in the carrier gas. The visual observations revealed the formation of standing waves in the film surface during drying at high gas velocities (>2OO cm/min). The wave formation at least partially overcomes the effect of skinning by increasing the surface area of the film, and may be the manifestation of flow instabilities involving circulation within the film.

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here