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Modeling the chemorheology of thermosetting resins during processing
Author(s) -
Martin G. C.,
Tungare A. V.,
Gotro J. T.
Publication year - 1989
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760291811
Subject(s) - thermosetting polymer , materials science , cyanate ester , curing (chemistry) , lamination , epoxy , rheology , composite material , viscosity , layer (electronics)
The curing conditions determine the rheological changes in the resin during the lamination of prepregs into multilayered circuit boards. In order to specify the optimum curing conditions during lamination, it is necessary to understand the rheology of the resin as it cures. In this study, the chemorheological behavior of two commercial epoxy resins and one cyanate‐based resin was characterized using an engineering model for the resin viscosity. A linear regression technique was used to evaluate the model parameters from the conditions at the minimum viscosity obtained during resin cures at constant heating rates. The technique was extended to predict the minimum viscosities reached by the resins when subjected to temperature conditions commonly encountered during lamination. The utility of the technique for specifying the curing conditions necessary to have a desired resin flow during lamination and for selecting resin systems for lamination based upon chemorheology has been demonstrated.