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Highly sensitive novolak‐based X‐ray positive resist
Author(s) -
Lingnau J.,
Dammel R.,
Theis J.
Publication year - 1989
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760291309
Subject(s) - resist , materials science , lithography , dissolution , photoresist , x ray lithography , matrix (chemical analysis) , x ray , nanotechnology , chemical engineering , composite material , optoelectronics , optics , layer (electronics) , engineering , physics
The application of X‐Ray lithography in mass production of devices is only economically viable if resist materials of highest sensitivity can be provided. Chemical amplification is the key concept to achieve such performance. It is outlined for a highly sensitive three component positive tone X‐Ray resist, consisting of a Novolak binder matrix, a starter compound, which—on X‐Ray exposure—yields an acid, which catalytically decomposes a dissolution inhibitor. Resist performance is discussed in terms of reaction kinetics and their implications on resist response, simulation, and handling procedures.