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Cure analysis of sheet molding compound in molds with substructures
Author(s) -
Fan JyhDar,
Lee L. James,
Kim Junil,
Im YongTaek
Publication year - 1989
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760291107
Subject(s) - materials science , transfer molding , mold , composite material , curing (chemistry) , molding (decorative) , sheet moulding compound , heat transfer , thermoforming , mechanics , physics
The effects of material flow, heat transfer, part geometry, and curing agents on the cure of sheet molding compounds (SMC) in molds with substructures were analyzed both experimentally and numerically. It was found that heat transfer during mold filling has a profound effect on the cure pattern, especially for fastcure resins molded for parts with thin dimensions.