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Effect of die wall cooling or heating on extrudate swell
Author(s) -
Vlcek J.,
Vlachopoulos J.
Publication year - 1989
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760291011
Subject(s) - die swell , swelling , materials science , rotational symmetry , composite material , swell , die (integrated circuit) , viscoelasticity , finite element method , weissenberg number , viscosity , extrusion , mechanics , thermodynamics , physics , nanotechnology
A general purpose finite element program was used to study polymer extrudate swelling. It is shown that viscosity variations due to externally applied cooling or heating have a significant influence on the swelling ratios of axisymmetric and planar extrudates. The effect is more pronounced at high Peclet and Weissenberg numbers. Swelling due to thermal effects and swelling due to viscoelasticity are not additive because of interrelations between the various mechanisms.