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Evaluation of dielectric cure models for an epoxy‐amine resin system
Author(s) -
Lane John W.,
Khattak Rangin K.,
Dusi Mark R.
Publication year - 1989
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760290513
Subject(s) - materials science , epoxy , dielectric , thermosetting polymer , composite material , rheology , relaxation (psychology) , viscometer , viscosity , polymer , conductivity , chemistry , psychology , social psychology , optoelectronics
The parallel‐plate test fixture on a Rheometrics viscometer was electrically isolated so that the rheological and dielectric properties of a thermoset polymer system could be simultaneously measured. This enabled the relationship between the dielectric properties and the rheological properties to be directly examined. A close relationship was established between the dielectric properties (dipole relaxation time and specific conductivity) and the pre‐gelation bulk viscosity. This relationship suggested that models similar in form to those used to describe the change in viscosity might be used to describe the changing dielectric properties. The limitations and advantages of two such models, which attempt to describe the time‐temperature behavior of the dielectric properties, were then tested for use with a typical aerospace epoxy resin system.