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Dielectric determination of cure state during non‐isothermal cure
Author(s) -
Day David R.
Publication year - 1989
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760290512
Subject(s) - dielectric , materials science , curing (chemistry) , isothermal process , conductivity , thermal conduction , cure rate , epoxy , polycarbonate , composite material , thermodynamics , chemistry , optoelectronics , medicine , physics , surgery
As a result of increased interest from industry in using dielectric cure monitoring, a need has arisen for simplifying frequency, cure, and temperature dependent data so that control decisions can be readily made. Techniques utilizing data covering several decades of frequency now exist for separating ionic conduction levels from dipole and electrode polarization responses. Ionic conduction levels are particularly useful since they can be correlated to both viscosity and extent of cure. In addition to being a function of extent of cure, dielectric properties are also influenced by temperature. This dependence often makes the dielectric response more difficult to interpret. This paper investigates two methods for overcoming the temperature dependence of the dielectric response during nonisothermal cure. The first method utilizes recent WLF modeling techniques and extends them with the end result of extracting T g in real time during cure. The second technique involves measuring the temperature dependence of uncured and cured material. Utilizing the correlation between log ionic conductivity and extent of cure, which has been noted by previous researchers, the normalized conductivity can be converted to a cure index. Several examples including epoxy, polyurethane, and a UV cured photoresist are presented, showing data before normalization and after both T g and cure index determination.