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Simultaneous dielectric and dynamic mechanical analysis of thermosetting polymers
Author(s) -
Gotro Jeffrey,
Yandrasits Michael
Publication year - 1989
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760290503
Subject(s) - thermosetting polymer , materials science , composite material , loss factor , curing (chemistry) , glass transition , rheometer , isothermal process , vitrification , dielectric , polymer , softening point , dielectric loss , viscosity , viscoelasticity , thermodynamics , rheology , optoelectronics , medicine , physics , andrology
This work presents a new method to measure simultaneously the dielectric loss factor and viscosity of thermosetting polymers during various cure cycles. A microdielectric sensor was mounted in the bottom plate of a parallel plate rheometer. Three types of high performance laminating resins were investigated. During non‐isothermal curing, dipole peaks were found to correspond to softening/devitrification, the maximum in the loss factor followed the same heating rate dependence as the minimum in the viscosity, and dipole peaks were observed to correlate with vitrification when the cure temperature was below the ultimate glass transition temperature of the resin.