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Polyvinyl alcohol‐copper II complex: Characterization and practical applications
Author(s) -
Godard P.,
Wertz J. L.,
Biebuyck J. J.,
Mercier J. P.
Publication year - 1989
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760290208
Subject(s) - materials science , polyvinyl alcohol , filler (materials) , polymer , polymerization , monomer , copper , adsorption , composite number , vinyl alcohol , composite material , epoxy , chemical engineering , organic chemistry , metallurgy , chemistry , engineering
Abstract A method to obtain microscopic and macroscopic coatings with improved resistance to debonding is described. The procedure, based on polymer‐metal complexes, involved the adsorption on inorganic substrates of a poly(vinyl alcohol)‐copper II chelate that is also able to catalyze the polymerization of monomers or prepolymers with grafting. The molecular structure of the complex, its adsorption on inorganic surfaces, and the mechanism of the polymerization induced by the supported catalyst are summarized. Much emphasis is placed on application of this technology to the realization of encapsulated filler and pigment and of coatings with improved adherence and solvent resistance. In the field of composite materials, it is demonstrated from several examples that the encapsulation of the filler can be a way to block chemical interactions between filler and matrix, to promote filler dispersion, and to improve mechanical properties.