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Bisbenzocyclobutene: A thermoset matrix host for rigid‐rod molecular composites
Author(s) -
Chuah H. H.,
Tan L.S.,
Arnold F. E.
Publication year - 1989
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760290205
Subject(s) - thermosetting polymer , materials science , composite material , benzocyclobutene , benzothiazole , polymer , organic chemistry , chemistry
An approach to realize the reinforcement of a thermoset system at the molecular level by rigid‐rod polymers was investigated. A mixture of bisbenzocyclobutene (BCB)‐terminated imide oligomers constitutes the thermosetting component, and the rigid‐rod polymer utilized in the present study was poly(p‐phenylene benzothiazole) (PBT). The cure chemistry of the thermoset materials is based on the ability of benzocyclobutene functions to homopolymerize under the influence of heat. Thermal properties as well as film processing and mechanical properties of PBT/BCB thermoset composites are presented.