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Process control of profile extrusion using thermal method. Part I: Mathematical modeling and system analysis
Author(s) -
Yang B.,
Lee L. J.
Publication year - 1988
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760281102
Subject(s) - extrusion , materials science , die (integrated circuit) , composite material , thermal , mechanical engineering , thermodynamics , engineering , physics , nanotechnology
An analytical model based on the heat penetration through the die wall was preposed to calculate the effect of die wall temperature on the flow of polymer melt in profile dies. Model prediction matched well with the experimental data measured from a modified Instron capillary rheometer. The model was applied to an extrusion line with an L‐shaped profile die. Dynamic responses of the profile extrusion line based on this die were measured and modeled. The pairing of manipulated variables and controlled variables was analyzed.