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Physical aging in thermosets of differing degrees of cure—master curve generation and the relation to mechanical properties
Author(s) -
Schwartz S. A.,
Bubeck R. A.
Publication year - 1988
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760280102
Subject(s) - thermosetting polymer , materials science , composite material , toughness , epoxy , yield (engineering) , tension (geology) , compression (physics)
Physical aging of a thermoset system based on bisphenol‐A epoxy (DER Trademark of The Dow Chemical Company. 383) and tetrabromobisphenol‐A cured with sulfanilamide and diaminodiphenylsulfone was studied as a function of cure history. Changes in the dynamic mechanical spectra for the thermoset system were correlated to changes in relative toughness associated with physical aging as determined by plane‐strain biaxial tension‐compression yield measurements. It was found that master curves, generated by using tan δ data obtained in the β relaxation temperature regime, are well related to the corresponding changes in mechanical properties and, hence, have predictive value. Relative toughness decreases and compressive yield increases with decreasing tan 5 because of decreased molecular segmental mobility. The relative extent of physical aging for the as‐cast thermosets was shown to be linearly related to the cure time.