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Effect of die temperature on the flow of polymer melts. Part I: Flow inside the die
Author(s) -
Yang Bing,
Lee L. James
Publication year - 1987
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760271408
Subject(s) - die (integrated circuit) , materials science , extrusion , capillary action , pressure drop , flow (mathematics) , composite material , volumetric flow rate , polymer , thermodynamics , mechanics , nanotechnology , physics
The effect of die wall temperature on the flow of polymer melts in circular capillary dies was studied. At constant flow rates, it was found that die wall temperature had a greater effect on the pressure drop than melt temperature. A capillary die with two circular channels with different diameters was designed to simulate the profile extrusion. Changes of wall temperature varied the flow rate ratio between the two channels. An implicit finite difference method was used to simulate the velocity and temperature profiles inside the die. Values predicted by this model matched well with experimental data for both dies.