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Coupling between stresses and moisture diffusion in polymeric adhesives
Author(s) -
Yaniv G.,
Ishai O.
Publication year - 1987
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760271006
Subject(s) - materials science , moisture , composite material , adhesive , epoxy , diffusion , stress (linguistics) , polymer , tension (geology) , compression (physics) , coupling (piping) , thermodynamics , layer (electronics) , linguistics , philosophy , physics
An experimental procedure is suggested for quantitative evaluation of the interdependence of stresses and moisture diffusion in polymer‐dominated materials with special emphasis on epoxy resin based polymeric adhesives. It has been found that when such material is stressed in tension, the moisture diffusion rate increases; and when in compression, it decreases. At low stress levels, a linear relation was obtained between the coefficient of moisture diffusion and the applied stress, while at elevated levels it is nonlinear. Throughout the loading range, the coefficient correlates well with the volumetric changes in the stressed material.