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The role of the latent image in a new dual image, aqueous developable, thermally stable photoresist
Author(s) -
Feely Wayne E.,
Imhof Joann C.,
Stein Cynthia M.
Publication year - 1986
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760261605
Subject(s) - photoresist , resist , latent image , materials science , coating , aqueous solution , yield (engineering) , optics , composite material , nanotechnology , image (mathematics) , computer science , artificial intelligence , layer (electronics) , chemistry , physics
A new dual image, aqueous developable photoresist can be processed to yield either positive or negative images that are crosslinked and thermally stable to temperatures >300°C. Positive images have similar resolution and processing parameters to conventional positive novolak resists. Negative resists from this system have a number of new and interesting properties that surpass the capabilities of their positive counterparts. In addition to producing highly resolved submicron images, thick coatings of resist can be used to form images with high aspect ratios. By adjusting the exposure of the resist, images with inward sloping wall profiles can be realized. As a result of the images being crosslinked and Insoluble in the resist coating solution, images can be recoated and new images formed over the top of existing patterns to form structures. A hypothetical mechanism that suggests that resist defects caused by dust on the mask or photoresist surface can be reduced In negative mode processing is also presented.