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High‐ T G base‐soluble copolymers as novolac replacements for positive photoresists
Author(s) -
Turner S. Richard,
Arcus Robert A.,
Houle Conrad G.,
Schleigh William R.
Publication year - 1986
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760261604
Subject(s) - copolymer , maleimide , materials science , polymer chemistry , differential scanning calorimetry , base (topology) , dissolution , thermogravimetric analysis , mica , polymer , organic chemistry , composite material , chemistry , mathematical analysis , physics , mathematics , thermodynamics
Several high‐ T g , phenolic copolymers based on N ‐(p‐hy‐droxyphenyl)maleimide with various comonomers were prepared, and the properties of a number of these copolymers were studied. The copolymers were 1:1 in composition and were predominantly alternating. The thermal properties of these copolymers were investigated by differential scanning calorimetry and thermal gravimetric analyses. The chain‐stiffening effect of the maleimide group was responsible for T g 's of 200°C and above. T g was a function of composition and molecular weight. Dissolution rates of thin films of these copolymers were investigated by laser interferometry. The dissolution rates were sensitive to copolymer molecular weight and to the functionality, i. e., the type of phenolic OH groups and the concentration of OH groups present. When these copolymers were used as binders for NDS (diazonaphthoquinone sulfonate) photochemistry, high‐resolution positive images were obtained that were resistant to thermal deformation at 200°C and above.