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The temperature‐dependence of some mechanical properties of a cured epoxy resin system
Author(s) -
Gupta V. B.,
Drzal L. T.,
Lee C. Y.C.,
Rich M. J.
Publication year - 1985
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760251305
Subject(s) - materials science , epoxy , composite material , ultimate tensile strength , intermolecular force , glass transition , toughness , modulus , relaxation (psychology) , fracture toughness , elongation , polymer , molecule , organic chemistry , psychology , social psychology , chemistry
The tensile mechanical properties and fracture toughness of a Bisphenol‐A type difunctional epoxy resin, cured with different amounts of metaphenylene diamine, using two cure cycles, were determined over a range of temperature. The tensile modulus in the glassy state was seen to be predominantly related to intermolecular packing, while in the rubbery state crosslink density was the important factor. Yielding appeared to be due to an increase in free volume as a result of dilatation during the tensile test and was related to a critical shear stress. The large strain properties like tensile strength, elongation‐to‐break, and toughness showed a more complex dependence on chemical structure, molecular architecture, intermolecular packing, and crosslink density. The roles played by the relaxation processes in determining mechanical properties are highlighted.