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Effect of humidity and temperature on the adhesive strength of pressure sensitive adhesives
Author(s) -
Lai Juey H.,
Knudson Curtis,
Hallgren Leander,
Douglas Richard B.,
Griffin Patrick
Publication year - 1985
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760251209
Subject(s) - adhesive , materials science , relative humidity , humidity , composite material , bonding strength , bond strength , sorption , pressure sensitive , thermodynamics , adsorption , chemistry , organic chemistry , layer (electronics) , physics
This paper reports the effect of humidity and temperature on the adhesive strength of a pressure sensitive adhesive (Flexbond 150) used to bond Mylar films. It has been found that, ill general, the adhesive strength decreases significantly with an increase in temperature. The effect of humidity on the bonding strength, however, was found to be process dependent. The sample preparation conditions, e.g., press weight for the bonding and the press time, are important in determining the humidity effect. The water sorption isotherm A 24°C for the adhesive was also determined. The amount of water sorbed by the adhesive at 95 percent relative pressure was found to be less than one weight percent.