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Organosilicon polymers for lithographic applications
Author(s) -
Shaw J. M.,
Hatzakis M.,
Paraszczak J.,
Liutkus J.,
Babich E.
Publication year - 1983
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760231816
Subject(s) - materials science , organosilicon , resist , polymer , siloxane , lithography , layer (electronics) , etching (microfabrication) , dry etching , nanotechnology , composite material , optoelectronics , polymer chemistry
Linear polymers of silicone gums (polysiloxanes) have many attributes that make them attractive for lithographic applications, such as oxidative and thermal stability, good adhesion properties, solubility in common solvents, and resistance to etching in an oxygen plasma. When polysiloxanes are used as the top imaging layer (∼2000Å) in a two‐layer resist system, the developed negative siloxane images act as a high resolution etch mask for the oxygen plasma etching of the bottom planarizing polymer layer. Commercially available polysiloxanes have been evaluated for their deep UV sensitivity at 2537Å, and have been found to have very high resolution capabilities (∼0.5μ) and high contrast (γ = 4). The negative images do not swell in the developer, and the line width is therefore independent of development time. The combination of high resolution, sensitivity, and ease of processing make this a simple multilayer system for deep UV and e ‐beam applications.