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Materials for multilevel resist schemes
Author(s) -
Reichmanis E.,
Wilkins C. W.,
Ong E.
Publication year - 1983
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760231812
Subject(s) - resist , materials science , compatibility (geochemistry) , masking (illustration) , planar , optoelectronics , nanotechnology , layer (electronics) , computer science , composite material , computer graphics (images) , art , visual arts
Bilevel resist processing techniques, offering the advantage of forming images on a planar substrate, and thus improving the resolution capability of optical projection printers are discussed. After careful consideration of such materials characteristics as UV absorption, solubility, compatibility, and T g , practical schemes can be developed, the simplest of which is one that uses conventional novolak‐quinone diazide positive resists as the top masking layer and short wavelength sensitive methacrylate based resists to planarize the substrate. Sub‐micron resolution and excellent line‐width control are achieved in these systems.