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Characterizing photoresists by thermal analysis
Author(s) -
Appelt B. K.
Publication year - 1983
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760230304
Subject(s) - exothermic reaction , materials science , differential scanning calorimetry , reactivity (psychology) , polymerization , printed circuit board , thermal , soldering , composite material , chemical engineering , optoelectronics , polymer chemistry , polymer , organic chemistry , thermodynamics , computer science , chemistry , medicine , physics , alternative medicine , pathology , engineering , operating system
Photoresists and solder masks are used extensively for manufacturing printed circuit boards to define and protect the circuits, respectively. These systems exhibit exothermic polymerization and crosslinking reactions upon exposure to UV light or to elevated temperatures. Differential scanning calorimetry (i.e., the heat of reaction) was, therefore, employed to characterize batch‐to‐batch variations and to characterize the photoreaction in these photosensitive materials. This technique allows unambiguous evaluation of the photoreaction independent of other parameters such as developer reactivity, temperature, and other variables that commonly interfere with functional tests.