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Addition polyimide adhesives containing various end groups
Author(s) -
Clair Anne K. St.,
Clair Terry L. St.
Publication year - 1982
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760220103
Subject(s) - polyimide , materials science , adhesive , composite material , polymer science , layer (electronics)
Addition polyimide oligomers have been synthesized from 3,3′,4,4′‐benzophenone tetracarboxylic acid dianhydride and 3,3′‐methylenedianiline using a variety of latent crosslinking groups as end‐caps. The nominal 1300 molecular weight imide prepolymers were isolated and characterized for solubility in amide, chlorinated and ether solvents, melt‐flow and cure properties, glass transition temperature, and thermal stability on heating in an air atmosphere. Adhesive strengths of the polyimides were obtained both at ambient and elevated temperatures before and after aging at 232°C. Properties of the novel addition polyimides were compared to a known nadic end‐capped adhesive, LARC‐13.