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Influence of moisture content on curing behavior of two‐step phenolic molding compounds
Author(s) -
Tonogai Saburo,
Hasegawa Kiichi,
Kondo Hitoshi
Publication year - 1980
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760201704
Subject(s) - curing (chemistry) , materials science , moisture , solvent , molding (decorative) , composite material , adduct , polymer chemistry , chemical engineering , organic chemistry , chemistry , engineering
Using prepared and commercial two‐step phenolic molding compounds, the influence of moisture on their curing behavior was examined by the disk cure test and the solvent extraction method for the early and middle stages of the curing process, respectively. It was determined that moisture in the compounds could enhance the curing rate and the degree of cure as well as flowability. A possible mechanism explaining the acceleration of curing was proposed, suggesting that moisture might facilitate catalytically the decomposition of hexamine or hexamine‐novolac adduct into reactive low molecular weight materials, which could then easily react with a resin even in a state of fairly advanced cure due to their facile diffusion.