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Device processing using the trilevel technique
Author(s) -
Moran J. M.,
Maydan D.
Publication year - 1980
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760201612
Subject(s) - lithography , wafer , materials science , x ray lithography , nanotechnology , computer science , optoelectronics , resist , layer (electronics)
Three front runners for the next generation of devices for fine line lithography are photo, electron, and X‐ray lithography. Each of these techniques has both advantages and disadvantages when considered for direct wafer processing. This paper discusses the problems encountered using each of these techniques and how a trilevel technique can be applied to make each of these techniques more viable.