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Time‐temperature cure behavior of epoxy based structural adhesives
Author(s) -
Doyle Michael J.,
Lewis Armand F.,
Li HinMo
Publication year - 1979
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760191007
Subject(s) - materials science , adhesive , epoxy , composite material , thermosetting polymer , curing (chemistry) , isothermal process , rheology , epoxy adhesive , natural rubber , physics , layer (electronics) , thermodynamics
Time/temperature cure profile diagrams of a nylon‐epoxy adhesive and a rubber‐modified epoxy based structural adhesive have been established from isothermal‐cure time torsional braid analysis measurements. The characteristic zones of liquid, gel‐rubber and glassy state behavior are noted on the diagrams. With the nylon‐epoxy adhesive, the time/temperature cure profile is ill‐defined since all the TBA data had to be obtained (due to the particular curing agent involved) at isothermal conditions above the glass temperature of the finally cured adhesive. In comparison, the rubber‐modified epoxy system showed distinct zones reflecting the various rheological states traversed during the thermosetting process. The dynamic mechanical. (Rheovibron), morphology, and adhesive joint strength properties are examined as a function of cure cycle.