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Effect of cure history on dynamic mechanical properties of an epoxy resin
Author(s) -
Lewis A. F.,
Doyle M. J.,
Gillham J. K.
Publication year - 1979
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760191006
Subject(s) - epoxy , materials science , glass transition , curing (chemistry) , isothermal process , composite material , dynamic mechanical analysis , braid , polymer , thermodynamics , physics
The effect of cure history on the dynamic thermomechanical properties of a high temperature curing epoxy resin has been studied using torsional braid analysis. In isothermal cures “full cure” is not possible except at temperatures above the maximum glass transition temperature ( T g ) of the cured resin, hence the necessity of a “post‐cure” after lower temperature isothermal cures. The highest T g and maximum cross‐linking in the cured resin was for a linear heating rate of 0.05°C/min from 30 to 200°C; higher heating rates lead to lower glass transition temperatures.