Premium
Thermal expansion instability and creep in amine‐cured epoxy resins
Author(s) -
Mark R.,
Findley W. N.
Publication year - 1978
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760180103
Subject(s) - materials science , creep , epoxy , thermal expansion , composite material , isothermal process , polyurethane , ultimate tensile strength , moisture , shrinkage , thermodynamics , physics
Similar thermal expansion instabilities, consisting of isothermal, time‐dependent changes in thermal expansion after a rapid change in temperature, were observed in epoxy resins with different degrees of cross‐linking. Creep experiments performed at different stages of expansion show decreases in tensile creep rate with decreased expansion. The role of changes in moisture content as a possible cause of the dimensional instability is examined for epoxy resins and a highly cross‐linked polyurethane. Results indicate that the state of expansion is the primary cause of changes in creep rate rather than temperature or moisture content.