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Thermally‐reacted poly(methacrylamide) as a positive electron beam resist
Author(s) -
Matsuda S.,
Tsuchiya S.,
Honma M.,
Hasegawa K.,
Nagamatsu G.,
Asano T.
Publication year - 1977
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760170616
Subject(s) - resist , methacrylamide , materials science , irradiation , cathode ray , electron beam processing , electron , ion , glass transition , copolymer , composite material , polymer , chemistry , organic chemistry , acrylamide , physics , layer (electronics) , quantum mechanics , nuclear physics
Thermally‐reacted poly(methacrylamide) degrades under high‐energy irradiation. It has a sensitivity of 2‐3 × 10 −7 C/cm 2 when exposed to 10 KV electrons. The resist is thermally stable to 330°C and has a high glass transition temperature, 180 200°C. It may be used for the lift‐off process and ion‐milling.