Premium
The thermal conductivity of nickel and copper dispersed in poly(vinyl chloride)
Author(s) -
Kusy Robert P.,
Corneliussen Roger D.
Publication year - 1975
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760150210
Subject(s) - vinyl chloride , materials science , thermal conductivity , copper , nickel , composite material , electrical resistivity and conductivity , volume (thermodynamics) , chloride , polyvinyl chloride , thermal , polymer chemistry , metallurgy , polymer , thermodynamics , copolymer , physics , electrical engineering , engineering
The thermal conductivity of segregated distributions of poly (vinyl chloride)/nickel (PVC/Ni) and poly(vinyl chloride)/copper (PVC/Cu) was measured for volume fractions ranging from 0 to 0.15. The thermal conductivities increased from 0.15 Btu/hr ft °F for unmodified PVC to 2.79 Btu/hr ft °F for PVC/15 percent Cu. While the thermal conductivity increased smoothly with volume loading, the electrical resistivity decreased discontinuously over fifteen orders of magnitude. Using the parallel slab model as a basis, a semi‐empirical model was deduced which described the thermal conductivity as a function of volume loading. With this work, a survey of the thermal, electrical, and mechanical properties of segregated PVC composites is complete.