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The physical significance of acid‐anhydride cures on epoxy adhesive properties
Author(s) -
May C. A.
Publication year - 1963
Publication title -
polymer engineering and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.503
H-Index - 111
eISSN - 1548-2634
pISSN - 0032-3888
DOI - 10.1002/pen.760030404
Subject(s) - phthalic anhydride , materials science , epoxy , adhesive , composite material , bond strength , curing (chemistry) , compressive strength , phthalic acid , organic chemistry , chemistry , catalysis , layer (electronics)
The influence of bulk physical properties on the bond strength of an adhesive was studied. A conventional epoxy resin when cured with various mixtures of phthalic acid and anhydride exhibits maximum bond strength when the curing agent is 75% acid and 25% anhydride. This effect is explained on the basis of physical properties of the unfilled resin systems. Most significant of these were the heat distortion temperature and the compressive break and yield strengths.